| 释义 |
solid phase bonding process
- 固态gù tài
solid state; solid phase; solidity
- 固相gù xiàng
solid phase; solidoid
- 耦合力ǒu hé lì
bonding force
- 位相wèi xiàng
phase
- 月相yuè xiàng
phase
- 实心的shí xīn de
solid
- 猝发过程cù fā guò chéng
bursting process
- 无间断的wú jiān duàn de
solid
- 锁相suǒ xiàng
phase lock; phase locking; lock phase
- 颧突quán tū
zygomatic process
- 湿法shī fǎ
wet process
- 采购过程cǎi gòu guò chéng
adoption process; acquisition process
- 迭代过程dié dài guò chéng
iteration process; iterative process
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 局面jú miàn
complexion, phase, phases
- 矛盾期máo dùn qī
ambivalent phase
- 隐藏期yǐn cáng qī
latent phase
- 逐步执行zhú bù zhí háng
phase
- 雄厚的xióng hòu de
abundant, rich, solid
- 父进程fù jìn chéng
parent process
- 羰基法tāng jī fǎ
carbonyl process
- 添加法tiān jiā fǎ
additive process
- 怜相lián xiàng
mobile phase; moving phase
- 稀相xī xiàng
dilute phase; lean phase
- 缝焊féng hàn
slit bonding
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