多芯片模块，简称MCM（Multi-Chip Module），是一种裸晶（die）、芯片、集成电路的包装、封装技术（Package），此种封装技术能在一个封装内容纳两个或两个以上的裸晶，而在此技术未发创前，一个封装内多半只有一个裸晶。

MCM依据制造方式的不同而有不同的类型，差别主要在于高密度互连（High Density Inteconnection；HDI）基板（Substrate）的形成方式：

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or ``pins") where multiple integrated circuits (ICs), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component (as though a larger IC). Other terms, such as "hybrid" or Hybrid integrated circuit, also refer to MCMs.