Ball grid array
![A grid array of solder balls under an integrated circuit chip, with the chip removed; the balls were left attached to the printed circuit board.](/Images/godic/202501/26/Solder_ball_grid5505.jpg")
![BGA ICs assembled on a PCB](/Images/godic/202501/26/BGA_RAM5505.jpg")
![X-ray of BGA](/Images/godic/202501/26/BGA_joint_xray5505.jpg")
![Intel Mobile Celeron in a BGA2 package (FCBGA-479); the die is blue](/Images/godic/202501/26/Celeron_mobile5506.jpg")
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.